Launching a new wave of direct-to-chip liquid cooling
Chilldyne's technology enables water to be used for direct-to-chip cooling of CPUs in high performance computers and servers. It's purpose-built to reduce operating expenditures for data centers and eliminates the risks associated with liquid cooling.
The StoryChilldyne spun out of Flometrics, an engineering services company that specializes in fluid dynamics and thermodynamics. Flometrics designs pumps, valves, blowers, nozzles and cooling systems for aerospace, medical and consumer applications. When we first heard that data centers waste half of their input power running air conditioners, we were shocked at the inefficiency. Aerospace engineering is all about efficiency, that is why you can fly from Singapore to Newark non-stop. For data centers, liquid cooling is much more efficient that air cooling. The reason that it is not widely implemented is that it is too expensive or too failure prone. The Cool-Flo system was designed by engineers and rocket scientists who know how to develop high performance aerospace system and low cost, reliable disposable medical devices. Data center servers are constantly being repaired. The server connections must never leak as the servers are removed and replaced. Even the best quick disconnects can be damaged, and the Chilldyne system ensures that damaged connectors do not leak coolant out. Furthermore, our liquid cooling pump can ingest air without a reduction in pumping power. We also offer fins on our cold plate which allows the server to still work air cooled if the liquid cooling is not plugged in. So, our system solves the problem of how to cool servers efficiently while maintaining uptime. The reason that it works so well is that it was designed by engineers with over 20 years of widely varied experience in fluid systems.
Our Team:The Chilldyne technical team has more than 20 years of experience in fluid dynamics and thermodynamics. The team has helped clients to develop a variety of commercially-successful products.
Dr. Steve Harrington
Chief Technology Officer
Dr. Harrington has over 27 years of commercial experience in the fields of fluid dynamics, thermodynamics and electronics cooling. His unique experience runs the gamut from consumer product development to science. He has been responsible for numerous successful product development projects and IP generations. He holds a dozen U.S. patents and is named on many more. Dr. Harrington also teaches the Senior Aerospace Design class at UCSD.
VP Business Development
Shlomo Novotny's experience spans over 25 years, leading multi-discipline international development teams that delivered cutting edge technology and products that exceeded technical requirements while meeting budgetary expectations. Mr. Novotny is a recognized industry leader on data centers and electronic and computer systems cooling, including the physical technology, mechanical and thermal aspects, and power architecture. He is one of the few industry experts in electronic cooling and packaging to be distinguished as an A.S.M.E. Fellow. With an extensive network of business connections, he combines technical expertise with a proven business ability. Mr. Novotny is a co-founder of the ASHRAE TC 9.9 technical committee and holds 20 patents. He is the co-author of several publications across the industry.
Gary Rowe is an accomplished entrepreneur, technology industry analyst/visionary and senior executive. His passion and career focus has been on identifying disruptive solutions supporting large enterprises in areas such as network/Internet standards, security/risk management, distributed ledger, identity management and next generation liquid cooling solutions. After 20 years of executive leadership positions with large computer and networking companies Mr. Rowe moved to an entrepreneurial focus as he architected, built and achieved successful exits for three companies and supported several others. He was President of Burton Group for 12 years, the leading technology infrastructure research firm through the sale to Gartner, the largest tech analyst firm in the world.
Mr. Rowe has been on Chilldyne’s Board of Directors for the past 6 years and has served as the Executive Chairman over the past year expanding his role to operationally support the company in areas including equity financing, business planning, refining/updating strategy, supporting strategic partnerships, expanding marketing and building out the infrastructure to take advantage of Chilldyne’s unique and sustainable competitive advantage.