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Chilldyne Information

Chilldyne FAQs

The Chilldyne FAQs answer the most common questions from potential liquid cooling users. There are answers specific to Chilldyne technology, but many of them apply to products from other liquid cooling vendors. Data center liquid cooling is a small percentage of the cost of the system, but it must be very reliable and robust. The Chilldyne negative pressure system has N+1 CDUs, never leaks water onto a server, and also works air cooled if necessary. No downtime is required for servicing. So if you want “worry free liquid cooling”, and you want to hear scientific facts about how it can provide your data center with density, efficiency and uptime, talk to us. Click the link below to download the FAQs

Negative Pressure Liquid Cooling – TechVision Research

A variety of technology, business and market factors are driving increased demand for liquid cooling solutions. This demand was initially focused on supporting the cooling of supercomputers and high-performance applications, but it is expanding to a far broader range of hardware throughout data centers, cloud computing/co-location facilities and a wide variety of other use cases. The single biggest barrier to widespread adoption is the perceived (and real) fear that a leak will cause severe damage to expensive hardware and cause extended downtime. Data center managers and IT executives are increasingly risk adverse and this has limited the initial receptivity for these solutions.
This short paper addresses the value proposition associated with the use of a negative pressure liquid cooling solution and how it differs from legacy data center cooling approaches.

Chilldyne White Papers

Liquid Cooling Heat Capture Ratio in the Attaway and Manzano Supercomputers

The heat capture ratio was measured at the server and data center scale for two top 100 supercomputers using negative pressure direct-to-chip liquid cooling.  At the server level, 68% – 82% heat capture ratios were measured with coolant close to ambient air temperature. Reducing fan speed and using cooler water increased the heat capture ratio. At the datacenter level, 66% and 78% heat capture ratios were measured. This study showed that the heat capture ratio is a function of the difference between the coolant and the air temperature, the CPU power, the cooling fan flow rate, and the motherboard and server design.

Thermal Resistance Comparison

Thermal resistance is a key consideration when selecting a cooling system. Thermal resistance will need to be lower for future higher power, lower temperature CPUs and GPUs. This short memo compares the state of the art thermal resistance for a 1U server for various technologies in the data center liquid cooling market.